ETEL Launches METIS HP Air-Bearing Platform for Semiconductor Scanning

The HEIDENHAIN subsidiary's full air-bearing planar platform targets direct laser writing, high-resolution inspection and maskless lithography with ±150 nm accuracy.

ETEL, part of HEIDENHAIN and a supplier of high-performance motion-control components and complete motion platforms, has introduced the METIS HP. The new full air-bearing planar platform is designed for demanding step-and-scan semiconductor applications, including direct laser writing and high-resolution optical inspection systems. ETEL says the product strengthens its position in high-precision motion control by combining speed, stability, dynamic straightness and projected tool-point measurement capability.

At the core of METIS HP is a multi-degree-of-freedom (mDoF) HEIDENHAIN encoder. According to ETEL, this encoder ensures accuracy without thermal drift. The architecture enables projected tool-point measurement. ETEL controllers can emulate a transistor-transistor logic (TTL) position signal for use as a trigger event.

ETEL presents this trigger approach as a compelling alternative to the classical interferometer used as an advanced trigger generator. The company says the platform does not need a mirror added to the carriage and avoids air lensing effects or air perturbation. ETEL also cites lower cost as an advantage of the design. These benefits are described by the company as characteristics of the new platform.

Specified accuracy and dynamics

ETEL lists the METIS HP's performance as ±150 nm accuracy over the full XY stroke after mapping, ±150 nm dynamic straightness at speeds up to 1 m/s, and dynamic capabilities reaching accelerations up to 20 m/s². The company says these capabilities minimize turnaround time and thereby increase machine throughput for step-and-scan applications.

ETEL positions the METIS HP across several demanding semiconductor motion tasks rather than a single-purpose stage. The listed intended uses include step-and-scan applications, direct laser writing, high-resolution optical inspection and advanced packaging inspection.

Fine control for inspection

High-end inspection applications for advanced packaging require rapid and precise focal-distance adjustments. METIS HP includes a high-bandwidth 4-DoF module that provides fine control over the Z, tip, tilt and theta axes. ETEL positions the platform as optimal for these demanding inspection tasks.

Large substrates and maskless lithography

The platform supports panel sizes up to 600 mm × 600 mm. According to ETEL, this addresses the growing need for next-generation maskless lithography with large-area substrates. The company also links the platform to advanced optical processes that require trajectory quality.

“Building on ETEL’s long-standing expertise in high-precision platforms, the METIS HP provides the trajectory quality required for advanced optical processes,” said Stéphane Pellegrini, product manager at ETEL. He said the platform's speed stability and dynamic straightness ensure consistent performance even at high scanning velocities. He added that support for panels up to 600 mm × 600 mm addresses the growing need for next-generation maskless lithography with large-area substrates.

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Zainab Farouk

Zainab Farouk is an editorial analyst covering sourcing and lifecycle decisions across circuit breakers, enclosures, test instruments, and drives used in electrical distribution and control. Her work compares replacement compatibility, conformity documentation, spare-part availability, lead times, maintenance intervals, and total cost of ownership, and it separates published product data from verified model-specific evidence. She writes for procurement managers, industrial distributors, and panel builders who must document substitution choices, plan spares, and justify lifecycle cost without relying on manufacturer claims.